Simulations in Guiding Gpbs PCB Design of Communication Systems

This paper describes how to effectively use CAD tools for SI and EMI analysis at 2.5Gbps to 12.5Gbps, and how different CAD tools to be involved in high speed PCB design process. It discusses providing design rules on board stack-up, predicting loss and its compensation using SpecctraQuest; validating device models and performs power/ground analysis for de-coupling capacitor selection and placement using Hspice; and obtaining accurate geometry parameters of special trace structures using Maxwell 2D and 3D field solver and Spicelink and HFSS. Successful design cases show how design goals are achieved at every stage. The result provides guidance to designers in meeting difficult technical requirements and in reducing testing cycles and part costs.